Q-Bridge Series thermal conductors from American Technical Ceramics (ATC) provide cost-effective solutions in standard EIA case sizes down to 0402. Smaller components in increased densities can present a thermal problem when there is no efficient method of redirecting heat away from vital components. It also avoids the firing processes common to ceramic capacitor construction, which prevents heat distribution variances. Since dielectrics employed in multilayer constructions must be accurately spaces, the single-layer construction reduces component variability. This process also uses purer-than-standard electrode material and only a single layer of dielectric. Photolithography achieves miniature capacitors and filters with accurate part-to-part and lot-to-lot parametric repeatability and tight tolerances, which increases production yields and performance reliability. Equipment is installed in Class 100 or Class 1,000 clean rooms and has 2.0µm line definition accuracy, which enables the construction of identical dielectric depositions in thin film substrates. These are primarily used in wireless applications sensitive to component variability at high frequencies, such as automotive collision detection modules. Smaller parts also typically operate at higher speeds with lower parasitics, making them more compatible with integrated circuit (IC) advancements.Īchieving Ultra-miniature Capacitors: Photo-lithography TechnologyĪdvancements in photolithography technology have dramatically improved the viability of miniature, ultra-low-profile, thin-film capacitors and filters.
OEMs and their electronics designers are looking for miniaturized parts to optimize circuit and system performance, satisfy physical design requirements, and improve product aesthetics. Inventive combinations of other techniques, including packaging designs, fine copper terminations, and photolithography have further expanded components for miniature circuit designs. These shifts have enabled extremely accurate computer-aided design (CAD) models which can be translated into marketable, real-world parts.
Improvements across multiple scientific fields have contributed to these designs, but the most notable progress includes purer ceramic, tantalum, and thin-film materials and improved processes, such as closed-loop manufacturing (CLM). To-date, the evolution of electronic components such as capacitors, resistors, diodes, and RF filters has trended toward continued miniaturization while retaining as many parametrics as possible and, at times, adding functionality. By Daniel West, Field Application Engineer, AVX and Ron Demcko, AVX Fellow